07/16/2025 | Press release | Distributed by Public on 07/15/2025 22:02
TOKYO - Nikon Corporation will begin accepting orders for the Digital Lithography System DSP-100, designed for back-end semiconductor manufacturing processes, starting in July 2025. This system is specifically developed for advanced packaging applications, supporting large substrates up to 600mm square and delivering high resolution of 1.0μm*1 (L/S*2).
Release Overview
Product name | Digital Lithography System DSP-100 |
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Sales launch | July 2025 |
Scheduled release | Fiscal Year 2026 |
Development Background
With the widespread adoption of high-speed communication technologies such as the internet of things (IoT) and generative artificial intelligence (AI), the volume of information processing is rapidly increasing, driving demand for high-performance semiconductor devices, especially in data centers. In addition, as advanced packaging technologies such as chiplets - that connect multiple chips side by side - continue to progress, circuit patterns are becoming increasingly fine, and package sizes are growing. In response to these challenges, demand for panel-level packaging (PLP) using resin or glass substrates is expected to see continued growth.
Performance Overview
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Resolution | 1.0μm L/S |
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Light Source | Equivalent to i-line |
Overlay Accuracy | ≦±0.3μm |
Supported Substrate Size*3 | Square substrate: up to 600x600mm |
Throughput | 50 panels/hour (with 510x515mm substrate) |
Key Benefits
Combining High Resolution and Productivity
The DSP-100 integrates Nikon's high-resolution semiconductor lithography technology with the multi-lens technology*4 from its flat panel display (FPD) lithography systems. It delivers high resolution (1.0μm L/S), excellent overlay accuracy (≦±0.3μm), and high productivity - up to 50 panels per hour using 510×515mm substrates.
Maskless Operation for Large Advanced Packaging Applications
Unlike conventional lithography systems that require photomasks with circuit patterns, the DSP-100 uses a spatial light modulator (SLM) to directly project circuit patterns onto substrates without the need for a photomask. This approach eliminates the size constraints of photomasks, provides greater flexibility for large, advanced packaging applications, and streamlines the development process - reducing both cost and lead time for customers.
Support for Large Square Substrates - 9x Productivity Compared to Wafers
The DSP-100 supports exposure on large square substrates up to 600×600mm. For 100mm-square large packages, productivity per substrate is nine times higher than when utilizing 300mm wafers. Additionally, the system offers high-precision correction for substrate warpage and deformation, reducing production costs with maskless technology and minimizing maintenance costs with solid state light sources, supporting greener manufacturing.
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