Dow to showcase AI thermal management materials at COMPUTEX Taipei 2026

Dow to showcase AI thermal management materials at COMPUTEX Taipei 2026

TAIPEI, June 2, 2026 - Dow (NYSE: DOW) will showcase thermal management materials designed to address the escalating heat and reliability challenges of AI-driven computing at COMPUTEX Taipei 2026, June 2-5, at the Nangang Exhibition Center (TaiNEX 2), Booth R3303a.

As AI workloads push power densities higher across data centers, servers and advanced semiconductor packaging, thermal management has become a critical constraint on performance, uptime and energy efficiency. At COMPUTEX, Dow will highlight its DOW™ Cooling Science technologies, a portfolio of materials developed to support more stable, reliable and scalable cooling technologies for next-generation AI infrastructure.

Aligned with the 2026 COMPUTEX theme, "AI Together," Dow's exhibit will focus on how materials science can help manage heat from the chip-level through the system-level, supporting higher computing performance while helping customers balance reliability, performance and sustainability.

"As AI adoption accelerates, thermal performance is becoming a defining frontier for the future of computing," said Cathy Chu, global strategic marketing director, Dow Consumer Solutions. "At COMPUTEX, Dow will demonstrate how we are shaping that future through advanced materials innovation, agile co-creation and close collaboration with customers-helping enable more stable, reliable and innovative cooling technologies that support the next generation of AI infrastructure and advanced packaging as system power continues to rise."

Eric Shao, Asia Pacific marketing director, Dow Industrial Solutions, commented: "As power density in AI data centers continues to rise, cooling systems have evolved from a matter of selecting a single fluid into a systems engineering discipline encompassing heat transfer efficiency, material compatibility, fluid life, and operations and maintenance management. At this year's event, based on the latest Dow Coolant Care Network concept, Dow is further strengthening its overall solution portfolio for data center coolant applications, helping customers to manage cooling loop performance and long-term operating results in a more systematic way."

Cooling solutions for AI data centers
Dow will feature cooling solutions designed for high-power AI computing environments, including liquid cooling and immersion cooling. These materials are engineered to support thermal stability, corrosion protection and system-level performance in demanding operating conditions.

• DOWSIL™ ICL-1100 Fluid supports single-phase immersion cooling, features a flash point above 200°C, and is designed to support thermal stability and long-term reliability.

For cold plate and facility-side loop coolant solutions, based on the latest Dow Coolant Care Network concept, Dow has built a coolant product portfolio spanning secondary and primary loops in data centers with DOWFROST™ LC 25 Data Center Cool Plate Coolant and DOWFROST™ HD Heat Transfer Fluid:

• DOWFROST™ LC 25 Heat Transfer Fluid supports liquid-cooled, direct-to-chip applications and is designed to help provide corrosion protection, including in high-surface-area copper components.
• DOWFROST™ HD Heat Transfer Fluid, supports primary circuits in data center facilities and is designed to help provide corrosion protection, microbial control and extended fluid life.

Thermal interface materials for AI servers and optics
Dow will also showcase thermal interface materials developed for AI servers and high-speed optical transceivers. DOWSIL™ thermal interface materials are designed for medium to high thermal conductivity, support thin bond lines and accommodate rework, while helping manage mechanical stress and shock in high-density assemblies.

Applications include AI server processors, power modules and optical transceivers operating at 400G, 800G and 1.6T speeds, where effective heat dissipation can help support signal integrity and device reliability.

Materials for advanced semiconductor packaging
In addition to system-level cooling, Dow will highlight silicone-based materials for advanced semiconductor packaging. These include thermally conductive adhesives and encapsulants designed to support heat transfer, strong adhesion and compatibility with other packaging materials.

Dow will also feature silicone hot-melt technologies developed to help reduce package warpage and support large-area molding processes, as well as materials designed for MEMS sensor sealing and long-term protection. These solutions are aimed at supporting increasingly complex packaging designs required by high-performance AI chips.

Forum speech at COMPUTEX Taipei
As part of the COMPUTEX forum program, Dr Myra Zhai, director for R&D and technical service, Asia Pacific, Dow, will deliver a keynote titled "Cooling AI-generation data centres" on Thursday, June 4, from 3:30 to 3:55 p.m. in Conference Room 701, TaiNEX 2, Nangang Exhibition Center. The presentation will share Dow's perspectives on how advanced cooling materials can help the industry address rising thermal demands driven by AI and high-performance computing.

Through its presence at COMPUTEX Taipei 2026, Dow aims to demonstrate how materials science can help support more reliable, energy-efficient and scalable AI infrastructure, helping customers navigate the thermal challenges shaping the next phase of computing.

About Dow Dow (NYSE: DOW) is one of the world's leading materials science companies, serving customers in high-growth markets such as packaging, infrastructure, mobility and consumer applications. Our global breadth, asset integration and scale, customer-focused innovation and leading business positions enable us to achieve profitable growth and help deliver a sustainable future. We operate manufacturing sites in 29 countries and employ approximately 34,600 people. Dow delivered sales of approximately $40 billion in 2025. References to Dow or the Company mean Dow Inc. and its subsidiaries. Learn more about us at https://www.dow.com.

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For further information, please contact:

Ang Yi Qin
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Coco He
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