New BZPACK mSiC® Power Modules Are Designed for Demanding Applications in Harsh Environments

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Note: The Microchip name and logo and the Microchip logo are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. mSiC is a registered trademark of Microchip Technology Inc. in the U.S.A. All other trademarks mentioned herein are the property of their respective companies.