Intel Foundry and ASML Accelerate Industry Readiness for High-NA EUV

"The companies building the increasingly complex AI products of the future need manufacturing innovations that are production-ready and easy to use," said Naga Chandrasekaran, Intel Executive Vice President and Co-General Manager of Intel Foundry. "Within our lithography capabilities, Intel Foundry is focused on near term enablement of High NA on 6-inch masks with or without stitching, and making the transition to 6x12-inch masks. We will continue to work closely with ASML and the entire industry to enable this transition."

Intel Foundry and ASML are building on years of collaboration to bring together the lithography ecosystem around larger-format masks, helping drive standards, infrastructure, and technology advances needed to support future High NA EUV scaling. Working alongside mask makers, automation suppliers, EDA partners, materials providers, and semiconductor manufacturers, the companies have helped establish the industry's path to larger-format masks while enabling customers to realize the benefits of High NA EUV today.

Presentations at SPIE Photomask Technology + Extreme Ultraviolet Lithography

This week at the SPIE Photomask Technology + Extreme Ultraviolet Lithography conference, Intel Foundry and ASML will share updates on reticle stitching, a technique that enables designers to use High NA EUV with today's standard 6-inch masks. ASML's Jan van Schoot will present "Scanner and mask requirements to support half field stitching" on Tuesday, September 8 at 11:00 a.m. Pacific time, followed by Intel Foundry's Kimberly Pierce, who will present "High-NA EUV: stitching for manufacturing" at 11:20 a.m. in the same session.