NGK Insulators Ltd.
NGK Insulators Ltd.
10/20/2025 | News release | Distributed by Public on 10/20/2025 05:16
Exhibition at SEMICON Europa 2025
NGK Insulators (NGK) will participate in the International Conference on SEMICON Europa 2025, which will be held in Munich, Germany, from Tuesday, November 18, 2025, to Friday, November 21, 2025. SEMICON Europa 2025 is one of the largest international exhibitions for the semiconductor and microelectronics industry in Europe, held every autumn in Munich. We will exhibit semiconductor related products, including our bonded wafers, EnerCera and Large current ceramic wiring boards.
Conference Overview
| Conference Name | SEMICON Europa 2025 |
|---|---|
| City / Country | München, Germany |
| Venue | Messe München |
| NGK booth | Booth No.C1469 |
| Official Website | SEMICON Europa 2025 |
| Dates | November 18 (Tue) to November 21 (Fri), 2025 |
Exhibited Products
Bonded wafers
Bonded wafers are substrates for electronic devices fabricated by bonding together differing materials. The two types of substrates are directly bonded without using adhesive and then the functional layer undergoes ultra-precise thin polishing. This enables the addition of physical properties such as high insulation, high thermal conductivity, low thermal expansion, and high rigidity of the base substrate to improve various characteristics including temperature characteristics. Hybrid bonded wafers contribute to creating higher integration, enhanced functionality, and higher output power for applications such as optical device, wireless communications, MEMS (Micro Electro Mechanical Systems) devices and high-power lasers. In addition to TFLN and TFLT, NGK will display InP bonded wafers at this exhibition.
Next-generation wafers website
InP bonded wafer for high power lasers and HEMT devices
InP bonded wafers are manufactured by directly bonding InP and SiC, a high heat-dissipating material. With its superior thermal conductivity, this wafer is expected to be applied to high-power lasers for telecom applications and HEMT (High Electron Mobility Transistor) devices for next-generation communication technologies such as 6G and optical communication.
EnerCera (ultra-thin battery ideal for wafer sensors)
EnerCera is an ultra-thin, highly safe, and wide-temperature-range rechargeable lithium-ion battery, making it an optimal power source for wafer sensors. By enabling precise monitoring of manufacturing processes through wafer sensors, EnerCera contributes to improved yield in semiconductor production.
At the upcoming exhibition, we will showcase real-world applications featuring EnerCera, highlighting its unique features and new possibilities.
Large Current Ceramic Wiring Board
Large Current Ceramic Wiring Board is a new solution for wiring connections, which reduces switching surges and enables full-speed operation of SiC power devices by embedded thick Cu conductors in multi-layer ceramic substrate through NGK unique ceramic technologies.
NGK Insulators Ltd. published this content on October 20, 2025, and is solely responsible for the information contained herein. Distributed via Public Technologies (PUBT), unedited and unaltered, on October 20, 2025 at 11:16 UTC. If you believe the information included in the content is inaccurate or outdated and requires editing or removal, please contact us at [email protected]