Material Agreement (Form 8-K)

Securitization Waiver

On April 10, 2026 (the "Closing Date"), Trinseo Ireland Global IHB Limited (the "Investment Manager"), Trinseo Holding S.à r.l. ("Trinseo Holding"), and Styron Receivables Funding Designated Activity Company (the "Borrower"), direct and indirect wholly owned subsidiaries of the Company, entered into an amendment and limited waiver (the "Securitization Waiver") to the Credit and Security Agreement, dated as of July 18, 2024, governing our accounts receivable securitization facility (as amended, the "Accounts Receivable Securitization Facility") by and among the Investment Manager, the Borrower, GLAS USA LLC, as administrative agent, GLAS Americas LLC, as collateral agent, KKR Credit Advisors (US) LLC, as structuring advisor, and the lenders party thereto, pursuant to which the requisite amount of lenders thereunder agreed to, among other things, (i) extend the temporary limited waiver of certain acceleration and collateral enforcement rights and remedies under such facility until April 30, 2026 (subject to further extension by the requisite lenders), as a result of the nonpayment of interest or principal beyond the applicable grace period under the Senior Loan Agreement, the Super HoldCo Second Lien Indenture and the Super HoldCo Credit Agreement (each as defined in the Securitization Waiver) and certain related notice and cross-defaults, (ii) reduce the advance rate thereunder from 92.5% to 90%, and (iii) amend certain other definitions, covenants and provisions thereunder.

In connection with the Securitization Waiver, the Borrower agreed to pay a structuring fee on the Closing Date equal to 0.25% of the aggregate amount of revolving commitments under the Accounts Receivable Securitization Facility.

The description of the Securitization Waiver included in this Current Report on Form 8-K does not purport to be complete and is qualified in its entirety by reference to the complete terms of the Securitization Waiver, a copy of which is attached hereto as Exhibit 10.1, and which is incorporated herein by reference.