Vishay Intertechnology Releases New Top-Side Cooling Mount Thick Film Power Resistor in Compact TO-263 (D2PAK) Package

MALVERN, Pa. - Sep. 29, 2026 - Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new Automotive Grade top-side cooling mount thick film power resistor. Designed for automotive applications, the Vishay Sfernice D2TO35S improves thermal performance and reduces board space requirements, while delivering high power dissipation of 35 W at 25 °C in the surface-mount TO-263 (D²PAK) package.

As thermal constraints increasingly become the primary system design limitation, many power components are transitioning from PCB-based cooling to top-side cooled architectures. By transferring heat directly to a heatsink, the D2TO35S released today enables up to nine times greater power dissipation than standard PCB-mounted devices when paired with an appropriate heatsink. Its compact, surface-mount design allows designers to increase power dissipation within the same footprint or provide the same functionality in a smaller footprint, while lowering PCB temperatures, reducing thermal stress on neighboring components, and improving overall system reliability.

Offering a non-inductive design for improved signal integrity and power handling in fast transient conditions, the D2TO35S features a resistance range from 4.7 W to 550 kW - with tolerances down to ± 1 % - thermal resistance of 4.28 °C/W, TCR down to ± 150 ppm/°C, and a wide operating temperature range from -55 °C to +175 °C. The RoHS-compliant device is solder reflow secure at 270 °C/10 s.

Samples and production quantities of the D2TO35S are available now with lead times of fourteen weeks.