High Density Packaging User Group and Global Electronics Association Announce New Copper Profile Test Method

High Density Packaging User Group (HDP) and the Global Electronics Association announce the release of a new test method, IPC-TM-650-2.2.23, based on the results of HDP's Non-Contact Copper Foil Profile project.

"This is a significant development as it relates to high-speed, high-performance applications where lower profile copper roughness is necessary," said Larry Marcanti, Executive Director of HDP User Group. "We thank Tsuyoshi Hiroaki-san of Mitsui-Kinzoku for his leadership of the Non-Contact Copper Foil Profile project and his continued leadership and efforts in the Correlating Copper Foil Profile to Signal Integrity project."

"The work done by HDP provided us with the empirical data necessary to create this new test method," said Matt Kelly, CTO, VP Technology Solutions at Global Electronics Association. "We are excited to continue and grow our collaboration with HDP, ensuring standards and test methods keep pace with the latest technology developments and are backed by strong technical data."