Murata Showcases ‘Powering the Future of AI’ at the 2025 OCP Global Summit

Murata will join industry leaders at the 2025 Open Compute Project (OCP) Global Summit, highlighting how its innovations are powering the future of artificial intelligence (AI) and accelerating the open compute ecosystem. The event takes place October 13-16 in San Jose at the McEnery Convention Center.

Attendees can experience Murata's vision firsthand at Booth B44, where the company will showcase its latest power rack solutions. These demonstrations will spotlight how Murata is setting new standards in efficiency, scalability, and reliability needed to support next-generation AI-driven environments. Guests will have the opportunity to see innovative technology in action and connect directly with Murata experts on real-world applications. Together, we will display the components that enable higher power density, enhanced signal integrity, optimized power delivery, and effective thermal management within chiplet architectures.

Additionally, as part of the summit's speaker series, Kevin Gero, Senior Applications Marketing Manager, Murata, will present 'Powering Progress: Murata's Role in Advancing OCP Innovation' on Thursday, October 16 at 12:30 PM. The session will highlight Murata's leadership in advancing OCP power solutions - from the evolution of ORV2 to ORV3 and the High-Power Rack initiative. Gero will share how the company is leading the transition towards standardized 50V architectures, enabling high-efficiency and high-density computing, and shaping the future of power delivery in AI and next-generation data centers.

For more information about Murata's participation in the 2025 OCP Global Summit, please visit here.

Murata in Brief

Murata Manufacturing Co., Ltd. is a worldwide leader in the design, manufacture and sale of ceramic-based passive electronic components & solutions, communication modules and power supply modules. Murata is committed to the development of advanced electronic materials and leading edge, multi-functional, high-density modules. The company has employees and manufacturing facilities throughout the world.