NGK Insulators Ltd.
NGK Insulators Ltd.
09/17/2025 | News release | Distributed by Public on 09/16/2025 20:52
Exhibition at ECOC 2025
NGK Insulators (NGK) will participate in the International Conference on European Conference on Optical Communication (ECOC) 2025, which will be held in Copenhagen, Denmark, from Sunday, September 28, 2025, to Wednesday, October 1, 2025. We will present our bonded wafers for optical communications. Additionally, we will exhibit related products, including our bonded wafers and ceramic substrates for optical communications.
Conference Overview
| Conference Name | European Conference on Optical Communication (ECOC) 2025 |
|---|---|
| City / Country | Copenhagen, Denmark |
| Venue | Bella Center |
| NGK booth | Booth No.C4230 |
| Official Website | ECOC Exhibition 2025 |
| Dates |
Conference: September 28 (Sun) to October 1 (Wed), 2025 Exhibition: September 29 (Mon) to October 1 (Wed), 2025 |
Presentation Overview
| Date and Time | September 30 (Tue), 2025, 16:10-16:40 |
|---|---|
| Room | Product Focus theatre |
| Title | Introduction to NGK Bonded Wafer for Optical Communication |
| Presenters | Masahiro Hazumi |
| Presentation Summary | We present our bonded wafer products, fabricated using direct bonding and high-precision polishing technology. These wafers are applied in various applications, including Thin-Film LiNbO3 (TFLN) photonic devices. With high crystallinity, uniform thickness, and exceptional stability, NGK's wafers contribute to launching the new markets for optical communication applications. |
Exhibited Products
Bonded wafers
Bonded wafers are substrates for electronic devices fabricated by bonding together differing materials. The two types of substrates are directly bonded without using adhesive and then the functional layer undergoes ultra-precise thin polishing. This enables the addition of physical properties such as high insulation, high thermal conductivity, low thermal expansion, and high rigidity of the base substrate to improve various characteristics including temperature characteristics. Hybrid bonded wafers contribute to creating smaller, faster, and less power-consuming devices for applications such as filters for 5G communications, modulation devices for optical communications, sub-terahertz (sub-THz) antennas, and MEMS (Micro Electro Mechanical Systems) devices. NGK will display TFLN bonded wafer for optical communications and other items at this exhibition.
TFLN bonded wafer for optical communications
TFLN bonded wafers for optical communications are high-performance wafers made by precision-polishing a bonded wafer consisting of lithium niobate (LN) bonded to a base substrate. This product offers thin-film LNs free of crystal damage, which contributes to the development of optical modulation devices featuring lower power consumption and smaller dimensions-ideal for data centers and core/metro networks.
Ceramic Substrates
As optical communication systems continue to evolve in response to increase in network traffic, the substrates used in optical transceiver modules are required to have advanced electrical, thermal, and high-frequency characteristics, along with high reliability.
NGK Insulators is developing next-generation ceramic substrates to meet such requirements.
NGK Insulators Ltd. published this content on September 17, 2025, and is solely responsible for the information contained herein. Distributed via Public Technologies (PUBT), unedited and unaltered, on September 17, 2025 at 02:52 UTC. If you believe the information included in the content is inaccurate or outdated and requires editing or removal, please contact us at [email protected]