Northrop Grumman Corporation

07/17/2025 | Press release | Distributed by Public on 07/17/2025 10:28

Northrop Grumman’s Microelectronics Center Magnifies the Microscopic

Manufacturing Microelectronics

Today's dynamic global security threats require solutions both big and small - solutions living within Northrop Grumman's Microelectronics Center. A radar system which once required about eight transmit-receive modules for certain functions, each the size of a stick of gum, now is made possible with one tiny chip measuring less than a square inch. This is just one example living across the hundreds of systems, leveraging microelectronics. Our quest to cut down on data loss, reduce size weight and power and the ability to provide a broader variety of materials for overall survivability have been accomplished because of the technological might of this center.

Northrop Grumman's secure microelectronics facilities produce millions of microchips a year, with the tailored design, fabrication and packaging needed to solve our nation's most advanced military and commercial challenges. (Photo Credit: Northrop Grumman)

From satellites and telescopes currently in orbit, to radars used in combat today - all are powered by our microchips, designed and developed within Northrop Grumman's Microelectronics Center.

"We keep out-inventing ourselves," said Matt Hicks, director of foundries, test and advanced packaging, Northrop Grumman Microelectronics Center. "We're pushing the boundaries of what physics and chemistry allow for our next-generation systems- both defense and commercial."

With access to more than 800 materials, Northrop Grumman has multiple facilities well-positioned to create the most leading-edge, mission-critical solutions in the microelectronics industry. (Photo Credit: Northrop Grumman)

From then to now

Initiatives used in Northrop Grumman foundries helped the United States level the playing field in Microelectronics fabrication using silicon and compound semiconductor devices. Our chips have been used to support the technology in the Lunar Camera that captured man's first steps on the moon, the development of cell-phones and in-flight wi-fi, the most advanced military radars and satellites, and the needs of next-generation systems. These have all been part of Northrop Grumman's microelectronics story linking back to decades of expertise in designing advanced solutions.

With current programs, the Northrop Grumman Microelectronics Center is testing and perfecting transistor technology, working across the defense industrial base and commercial landscape to develop key technologies that will be integrated into ground breaking systems. "We are working to create the very best microelectronics solutions for systems and platforms to deliver success for the warfighter time and time again," said Ben Heying, director of microelectronics at Northrop Grumman's Space Park foundry. "Our solutions support battlespace missions but also link to our everyday lives in many of the more advanced commercial applications that we produce."

Differentiating microelectronics capabilities are pioneering technological solutions in Northrop Grumman's accredited foundries and advanced packaging facility. (Photo Credit: Northrop Grumman)

"For future missions, microelectronics expertise is critical to developing emerging capabilities and improving the size, weight and power of future systems. Our advanced packaging expertise enables us to fit more functionality into a smaller form factor for those smaller platforms that we know are needed in the military world," said Dave Shahin, manager of the advanced packaging business unit for the Northrop Grumman Microelectronics Center. "We are well-positioned to do many of these capabilities, and even expand them here on U.S. soil to meet our customers' needs across the domestic industrial base."

Drive toward mission success

Today, Northrop Grumman's secure microelectronics facilities produce millions of microchips a year, with the critical, advanced and mission-tailored manufacturing process from design to deployment. Northrop Grumman continues building on successful internal fabrication and packaging, most recently including a major capability and capacity expansion of our proven wafer post-processing facility in Florida, planning to more than triple volume in the coming years. Northrop Grumman's Microelectronics Center is defining possible every day. What comes next is immeasurable.

Northrop Grumman Corporation published this content on July 17, 2025, and is solely responsible for the information contained herein. Distributed via Public Technologies (PUBT), unedited and unaltered, on July 17, 2025 at 16:28 UTC. If you believe the information included in the content is inaccurate or outdated and requires editing or removal, please contact us at support@pubt.io