Advancing Qubit Manufacturing with Precision Surface Processing

Advancing Qubit Manufacturing with Precision Surface Processing

News | May 28, 2026

Qubit manufacturing is becoming a vital area of focus for the industry. As quantum computing continues to evolve from theory to practice, the complexity of qubit fabrication is becoming increasingly clear. While much attention is often placed on deposition technologies such as molecular beam epitaxy (MBE) and atomic layer deposition (ALD), we see an equally critical role for wet processes used in precision surface processing (PSP). At Veeco, we are focused on how PSP enables the interface control and material integrity required to push qubit performance forward.

Across the quantum landscape-whether superconducting, photonic, or quantum dot-based-device performance ultimately hinges on coherence time and fidelity. These, in turn, are highly sensitive to defects, contamination, and inconsistencies at material interfaces. This is where PSP becomes indispensable.

Interface Engineering: Why Every Surface Matters in Qubit Manufacturing

In qubit manufacturing, every interface matters. From substrate preparation to thin-film deposition and patterning, any imperfection-down to the atomic level-can lead to degraded qubit performance. As a result, interface engineering is emerging as a foundational requirement across all qubit architectures.

Veeco views PSP as a key enabler of this interface control. Pre-deposition cleans, post-deposition surface treatments, and residue removal steps all contribute to ensuring that each subsequent layer is formed on a pristine, well-controlled surface. These processes are not isolated steps-they are deeply interconnected with deposition and etch technologies such as ALD and atomic layer etch (ALE), which are used to create and refine the thin films and interfaces central to qubit operation.

ALD, for example, is widely used to deposit superconducting materials such as niobium nitride (NbN) and niobium titanium nitride (NbTiN) with atomic-scale precision, while ALE offers a pathway to selectively remove material at similarly fine scales. Together, these techniques depend on-and benefit from-high-quality surface preparation and cleaning. Without the effective wet processes utilized for PSP, even the most advanced deposition processes cannot achieve their full potential.

Precision Surface Processing Steps in the Qubit Manufacturing Flow

Our PSP offerings span multiple critical steps in the qubit manufacturing flow:

• Pre-epitaxy cleans: Removing native oxides and contaminants from the substrate surface prior to deposition is essential for achieving high-quality film growth. In some cases, this involves transitioning surfaces from hydrophilic to hydrophobic states, which introduces additional challenges in maintaining cleanliness and preventing particle adhesion.
• Post-epitaxy cleans: After thin film deposition, exposed surfaces must be carefully cleaned without damaging delicate layers such as complex oxides. High-efficiency cleaning processes can achieve >99% particle removal while maintaining minimal material loss, preserving the integrity of the deposited films.
• Post-etch residue removal (PERR): Dry etch steps used to define qubit structures-such as Josephson junctions or quantum dot features-often leave behind fluorocarbon polymers and other residues. These must be completely removed to ensure clean sidewalls and reliable electrical or optical performance.
• Material lift-off (MLO): Patterning metal features, including contacts and electrodes, frequently relies on lift-off processes. Achieving complete lift-off without damaging underlying structures or leaving residual debris is particularly important for qubit devices, where defects can directly impact coherence.
• Photoresist strip and surface preparation: Removing masks and preparing surfaces for subsequent steps are routine but critical processes that must be executed with high selectivity and minimal contamination.

Taken together, these PSP steps form a continuous thread throughout the manufacturing process, enabling consistent interface quality from start to finish.

Addressing the Unique Challenges of Quantum Device Fabrication

While many PSP techniques are well established in semiconductor manufacturing, qubit fabrication introduces unique challenges that require a more nuanced approach.

One key challenge is sensitivity to damage. Traditional wet bench processes, particularly those relying on high-power ultrasonics, can introduce mechanical or chemical damage to delicate structures. For qubit devices, where even minor defects can be catastrophic, gentler yet highly effective cleaning methods are required.

Another challenge is complete residue removal in high-aspect-ratio features. Advanced qubit architectures, including those incorporating through-silicon vias (TSVs) or complex topographies, demand cleaning solutions capable of reaching and effectively treating difficult geometries.

Additionally, material diversity is increasing. Superconducting qubits, photonic qubits, and quantum dots each involve different materials and process flows, yet all require stringent interface control. PSP must therefore be flexible enough to handle a wide range of chemistries, substrates, and film types.

Veeco's WaferStorm and ImmJET Approach to Quantum Wet Processing

At Veeco, we have developed PSP solutions that address these challenges through a combination of immersion and high-pressure spray technologies. Our approach is designed to deliver both the precision and the scalability needed for emerging quantum applications.

Our ImmJET^™ technology, part of our WaferStorm wet processing platform, combines solvent immersion with high-pressure single-wafer spray, enabling effective penetration and removal of resist and unwanted materials while minimizing damage. This hybrid approach has demonstrated superior performance in metal lift-off and photoresist strip applications, achieving complete removal without residual contamination.

High-pressure spray capabilities-reaching up to 3,000 pounds per square inch gauge (psig)-are particularly valuable for removing stubborn residues such as sidewall fluorocarbon polymers left after dry etch processes. At the same time, advanced filtration and chemical management systems ensure that redeposition and cross-contamination are minimized.

Equally important is our focus on process integration. PSP is not a standalone step; it must work seamlessly with deposition, etch, and metrology processes. By offering a portfolio that spans pre- and post-deposition cleans, residue removal, lift-off, and surface preparation, we enable a more integrated approach to interface engineering.

Enabling the Path to Scalable Quantum Computing

Today, the quantum computing industry remains in an early stage, with multiple qubit architectures competing for dominance. As a result, demand for manufacturing equipment is still developing, and large-scale production has yet to fully materialize. However, we have already seen meaningful adoption of PSP tools across leading research and development efforts, with systems deployed to support a variety of qubit technologies.

Looking ahead, we expect the importance of PSP to grow significantly as the industry moves toward higher qubit counts and improved fidelity. Achieving these goals will require not only advances in deposition and device design but also continued innovation in how surfaces and interfaces are prepared and maintained.

The path to scalable quantum computing will be defined by our ability to control materials at the atomic level-across every step of the process flow. Through our PSP solutions, we are helping to lay the groundwork for that future, enabling cleaner interfaces, more reliable devices, and longer coherence times.

Explore the Veeco Quantum Series

This post is the latest in our series on challenges and opportunities in the quantum space. Read the earlier installments:
Did you know Veeco's products play a critical role in qubit manufacturing?
Driving Quantum Innovation: Veeco's Advances in Materials Engineering for the Next Era of Computing.
To engage with Veeco for your qubit manufacturing needs, click here.